Brittle material processing equipment-Global supplier

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15800683989
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2nd Floor, Building 2, No. 88 Xifei Road, Jiuting Town, Songjiang District, Shanghai

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Brittle material processing equipment

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1. Adopting a fully enclosed design, the optical path adopts imported optical components to ensure stability.

2. Using an optical marble platform, high-precision linear motor, and negative pressure adsorption system, the processing accuracy is high and there is no need to replace consumables.

3. Fully closed-loop feedback, equipped with high-precision CCD automatic positioning system.

3. Adopting non-contact processing, the cutting edge is smooth without chipping, with a high yield rate and fast processing speed.

PRODUCT MODEL	CL-BMC3	CL-BMC5	CL-BMC10	CL-BMC20
laser device	UV laser
average output power	3W	5W	10W	20W
Rate stability	＜2.0%
Processing area	400mm×300mm
Motion Platform	Imported high-speed and high-precision linear motor
Z-axis lifting range	100mm
Options	CCD visual positioning system
Size of collapsed edge	<10 μ m (depending on the material)
dimensional accuracy	±10μm
conicity	＜2°
Cutting thickness	≤0.05mm
cutting efficiency	Sapphire T0.3mm φ 10 2s/pcs 0.8mm glass 1mm/s
Applicable materials	Transparent materials such as sapphire, glass, ceramics, etc
Environmental requirements	Temperature: 18-27 ℃ Relative humidity:<60% (no condensation)

Fingerprint recognition glass, ceramic cutting, sapphire and reinforced glass cutting and drilling, LED sapphire filament holder cutting, sapphire HOME key cutting for mobile phones, camera protective lens cutting, sapphire glass mobile phone screen cutting, sapphire cover cutting for mobile phones, watches and wearable devices, etc.

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